Performance investigation of bonded manifold microchannel heat exchanger with high aspect ratio

Journal Information

J. Hefei Univ. Tech. (Nat. Sci.), Oct.2024, Vol.47 No.10: 1321-1327

DOI: 10.3969/j.issn.1003-5060.2024.10.004

Authors

MA Jiawei $ ^{1} $, YE Bin $ ^{1} $, ZHANG Zhongzheng $ ^{2} $, GAO Cai $ ^{1} $

(1. School of Automobile and Traffic Engineering, Hefei University of Technology, Hefei 230009, China; 2. Anhui Province Engineering Laboratory of Thermal Management Technology, The Sixteenth Research Institute of China Electronics Technology Group Corporation, Hefei 230088, China)

Abstract and Keywords

Abstract: The rapid development of semiconductors and other micro-scale electronic technologies has led to a dramatic increase in chip power density. The increase in power poses a severe challenge to the heat dissipation of electronic devices, and microchannel heat exchangers can effectively solve the heat dissipation problem of these devices. In this paper, a bonded manifold microchannel heat exchanger was developed with a size of $ 13.00 \, mm \times 12.00 \, mm \times 0.88 \, mm $ and an aspect ratio (AR) of microchannels of up to 10.5. The thermal and hydraulic performance of the cooling module was evaluated in terms of hot spot temperature, thermal resistance, and system pressure drop. The results show that when deionized water is used as the working medium and the water flow is 150 mL/min, the heat exchanger dissipates up to $ 1 \, 200 \, W/cm^2 $ heat flux at a chip temperature of $ 82.1 \, ^{\circ}C $, a total thermal resistance of $ 0.052 \, cm^2 \cdot K/W $ and a pressure drop of $ 260 \, kPa $. The present work provides a new strategy for using single-phase water to cool power electronics with high heat flux.

Keywords: microchannel heat exchanger; manifold structure; bonded; chip cooling; high heat flux

作者信息

马佳伟 $ ^{1} $，叶斌 $ ^{1} $，张忠政 $ ^{2} $，高才 $ ^{1} $

（1. 合肥工业大学汽车与交通工程学院，安徽合肥 230009；2. 中国电子科技集团公司第十六研究所安徽省热管理技术工程实验室，安徽合肥 230088）

摘要和关键词

摘要: 半导体和其他微尺度电子技术的迅速发展导致芯片功率密度急剧增加,而功率的增加使电子设备的散热面临严峻挑战,微通道换热器则可以有效解决电子设备的散热问题。文章设计了一种微通道深宽比(aspect ratio, AR)高达10.5且单个歧管微通道换热器尺寸为 $ 13.00\ mm\times12.00\ mm\times0.88\ mm $的粘接式歧管微通道换热器,并从热点温度、热阻、系统压降3个方面评估换热器冷却模块的热工性能和水力性能。研究结果表明,当以去离子水为工作介质且水的体积流量为150 mL/min时,换热器在芯片温度为82.1 ℃、总热阻为 $ 0.052\ cm^{2}\cdotK/W $、压降为260 kPa时,散热高达 $ 1200\ W/cm^{2} $。该研究为使用单相水来冷却高热通量的电力电子设备提供了一种新的思路。

关键词: 微通道换热器；歧管结构；粘接式；芯片冷却；高热流密度

Funding

国家重点研发计划资助项目（2020YFA0709703）；安徽省高校自然科学基金重点资助项目（KJ2021A1457）

合肥工业大学学报(自然科学版)

Navigation