合肥工业大学校徽

合肥工业大学学报自科版

合肥工业大学学报(自然科学版)

JOURNAL OF HEFEI UNIVERSITY OF TECHNOLOGY (NATURAL SCIENCE)

主管：中华人民共和国教育部

主办：合肥工业大学

ISSN 1003-5060, CN 34-1083/N

MEMS 传感器异质材料键合界面的可靠性分析

Reliability analysis of heterogeneous material bonding interfaces in MEMS sensors

期刊信息

合肥工业大学（自然科学版），2025年4月，第48卷第4期：469-474

DOI: 10.3969/j.issn.1003-5060.2025.04.006

作者信息

袁婷，许高斌，关存贺，马渊明，冯建国

（合肥工业大学微电子学院，安徽合肥230601）

摘要和关键词

摘要: 微机电系统(micro-electro-mechanical system, MEMS)传感器的制备会涉及多种材料的键合, 键合过程中不同材料之间由于热膨胀系数不同而产生各种内部应力, 当应力大于键合强度时, 材料分层从而导致器件失效。为了明确异质材料间微观应力对器件可靠性的影响, 文章考虑材料的热膨胀系数和温度影响下的杨氏模量, 利用 COMSOL 仿真获得的应力数据建立异质材料间的键合界面应力在不同温度、热膨胀系数和杨氏模量 3 种因素共同影响下的理论数学模型; 并针对 MEMS 传感器中的硅-玻璃键合界面, 基于相关键合强度数据, 结合蒙特卡洛方法和应力强度干涉模型计算得到异质材料键合界面的可靠度。结果显示, 异质材料键合界面的可靠度为 0.992108, 表明在服从韦布尔分布下的温度产生的应力不足以引起材料失效, 此时器件的稳定性和可靠性较高, 验证了所建模型的正确性和实用性, 实现了对 MEMS 传感器退化行为的建模及预测。

关键词: 微机电系统（MEMS）传感器；异质材料；键合界面；热应力；可靠性

Authors

YUAN Ting, XU Gaobin, GUAN Cunhe, MA Yuanming, FENG Jianguo

(School of Microelectronics, Hefei University of Technology, Hefei 230601, China)

Abstract and Keywords

Abstract: The fabrication of micro-electro-mechanical system(MEMS) sensors typically involves the combination of multiple materials, which leads to various internal stresses due to the differences in coefficients of thermal expansion during the bonding process. When the stress exceeds the bonding strength, material delamination occurs, resulting in device failure. To characterize the impact of microscale stresses between heterogeneous materials on device reliability, this study considered the effect of temperature on the coefficients of thermal expansion and Young's modulus of materials, and established a theoretical model for bonding interface stresses between heterogeneous materials with combined effects of different temperatures, coefficients of thermal expansion, and Young's modulus using stress data obtained through COMSOL simulation. Relevant strength data for the silicon-glass bonding interface in MEMS sensors was collected, and the reliability of the bonding interface of heterogeneous materials was calculated using Monte Carlo simulation and stress intensity interference models. The results show that the reliability of the bonding interface of heterogeneous materials is 0.992 108, indicating that the stress generated under Weibull distribution of temperature is insufficient to cause material failure. The device exhibits high stability and reliability, which validates the correctness and practicality of the established model, and enables the modeling and prediction of the degradation behavior of MEMS sensors.

Keywords: micro-electro-mechanical system (MEMS) sensor; heterogeneous material; bonding interface; thermal stress; reliability

基金信息

国家重点研发计划资助项目（2020YFB2008901）；安徽省发改委研发创新资助项目（JZ2021AFKJ0050）

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